ZCLC-3XL-1000Air Cooling Buffer Machine
1. User-friendly interface control system with simple function switching.
2. PLC control system with multiple electrical circuit protection for safety and stability.
3. Buffer area with 20 pitches available for PCB placement.
4. Supports multiple functions: first-in-first-out (FIFO), last-in-first-out (LIFO), and straight-through.
5. Servo positioning system for precise positioning, fast lifting speed, and high production efficiency.
6. Standard SMEMA signal communication method.
7. Innovative structure allows full contact of PCB surface with cold air for rapid cooling.
Technical Parameters and Specifications:
1. Can serve as a buffer between SMT machines. Used for rapid cooling of PCB after reflow soldering or high-temperature equipment.
2.PCB Capacity: 20 pieces or user-defined.
3.Maximum Load: 5 kg/ PCB.
4.Cycle Time: Approximately 12s.
5.Pitch Selection: 30 mm, 60 mm, or user-defined.
6.Power Supply: 220V AC, single-phase, maximum 850 VA.
7.PCB Thickness: Minimum 0.6 mm.
8.Effective PCB Size (L*W): L800*W460 mm, other specifications customizable.
9.Transmission Height: 900 ± 20 mm.
10.Dimensions (LWH): L1000W1200H1750 mm.
11.Transmission Direction: Left to right or right to left (optional).
12.Transmission Method: Stainless steel roller transmission.
13.Approximate Weight: 400 kg.
14.Cooling Method: Air curtain fan.
